• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A method of manufacturing at least one cover for an electronic box, comprising the following steps: placing at least one optical insert (15), having opposite faces (17, 18) and able to be traversed by light radiation, between two opposite faces (24,25) of a cavity (23) of a mold in a position such that said faces of the optical insert are in contact with said faces of said mold cavity, injecting a coating material into said cavity, around said optical insert, harden the coating material to obtain a plate (12) overmolded around said optical insert, so as to achieve at least one cover (11) comprising at least one optical insert and to minus a portion of said overmoulded plate. An electronic package comprising a chip encapsulation cover (11) comprising a plate (12) overmolded around an optical insert (15) passing light radiation from one side to the other of the over-molded plate.
    公开号:FR3061630A1
    申请号:FR1750051
    申请日:2017-01-03
    公开日:2018-07-06
    发明作者:Karine Saxod；Alexandre Mas；Eric Saugier；Gaetan Lobascio；Benoit Besancon
    申请人:STMicroelectronics Grenoble 2 SAS；
    IPC主号:
    专利说明:

    © Holder (s): STMICROELECTRONICS (GRENOBLE
    2) SAS Simplified joint-stock company.
    O Extension request (s):
    (® Agent (s): CASALONGA.
    (54) METHOD FOR MANUFACTURING A COVER FOR ELECTRONIC BOX AND ELECTRONIC BOX INCLUDING A COVER.
    FR 3,061,630 - A1 (57) Method for manufacturing at least one cover for an electronic unit, comprising the following steps:
    placing at least one optical insert (15), having opposite faces (17, 18) and capable of being traversed by light radiation, between two opposite faces (24,25) of a cavity (23) of a mold in a position such that said faces of the optical insert are in contact with said faces of said mold cavity, inject a coating material into said cavity, around said optical insert, harden the coating material to obtain 'a plate (12) molded around said optical insert, so as to produce at least one cover (11) comprising at least one optical insert and at least a portion of said molded plate.
    Electronic unit comprising an encapsulation cover (11) of a chip, comprising a plate (12) overmolded around an optical insert (15) allowing light radiation to pass from one side to the other of the overmolded plate.

    Method for manufacturing a cover for an electronic box and electronic box comprising a cover
    The present invention relates to the field of electronic boxes, in particular those which include electronic chips including emitters of light radiation and / or sensors of light radiation.
    It is known to make electronic boxes which include electronic chips provided with integrated optical elements, sensors and / or emitters of light radiation, mounted on support plates and which include covers for encapsulating the chips which are mounted on the support plates. These covers are fitted with light-passing optical elements, generally made of glass, which are attached to the covers after the latter have been mounted on the support plates and which are fixed to the covers by means of layers of adhesive. .
    According to one embodiment, a method of manufacturing at least one encapsulation cover for an electronic unit is proposed, comprising the following steps:
    placing at least one optical insert, having opposite faces and capable of being traversed by light radiation, between two opposite faces of a mold cavity in a position such that said faces of the optical insert are in contact with said faces of said mold cavity, inject a coating material into said cavity, around said optical insert, and harden the coating material to obtain a molded plate around said optical insert, so as to produce at least a cover comprising at least one optical insert and at least a portion of said overmolded plate.
    The method may include a subsequent step of cutting through said overmolded plate and at a distance from said optical insert.
    The mold may comprise opposite layers of compressible material forming at least in part said faces of said cavity, said opposite faces of said optical insert being supported on these layers.
    Said opposite faces of the mold may be parallel.
    One of said faces of the mold cavity may comprise at least one zone surrounded by at least one groove, one of the faces of the optical insert being in contact above this zone, so that said cover plate obtained is provided with at least one projecting rib corresponding to said groove of the mold.
    The method may include a subsequent cutting step carried out through said projecting rib.
    One of said faces of the mold cavity can comprise at least two zones surrounded by at least one main projecting groove and separated by at least one intermediate groove, optical inserts having faces in contact above said zones, so that said cover plate obtained is provided with at least one projecting peripheral rib corresponding to said main groove of the mold and at least one intermediate rib corresponding to said intermediate groove of the mold.
    The method may include a subsequent cutting step carried out through said main projecting rib.
    Said intermediate groove may have a shallower part, so that said cover plate obtained is provided with an intermediate rib having a notch corresponding to said intermediate groove of the mold.
    An electronic box is also proposed which comprises: a support plate;
    at least one electronic chip having a rear face fixed to a front mounting face of the support plate and provided with at least one optical element integrated in its front face; and a cover for encapsulating said chip, comprising a plate overmolded around an optical insert allowing light radiation to pass from one side to the other of the overmolded plate, said cover being fixed at least above said plate of support.
    Said cover can be fixed above said support plate by means of an annular bead of glue or an annular band of glue, interposed between a peripheral zone of the support plate and a peripheral zone of said plate molded.
    Said overmolded plate may be provided with an annular rib surrounding said chip at a distance, the cover being fixed above said support plate by means of a strip of adhesive interposed between said support plate and said annular rib.
    Said overmolded plate can be provided with an intermediate rib delimiting two chambers, this intermediate rib being fixed above said support plate by means of a strip of glue.
    The support plate can be provided with two electronic chips located respectively in said chambers.
    The support plate can be provided with an electronic chip which extends through a notch of said intermediate rib, this intermediate rib being fixed to this chip by means of a strip of glue.
    Said electronic chip can be provided with two optical sensors located on either side of said intermediate rib.
    The support plate can be provided with another electronic chip provided with an optical transmitter.
    Said overmolded plate can be provided with two optical inserts located on either side of said intermediate rib.
    A cover is also proposed for an electronic unit which includes an optical insert having opposite faces, made of a material capable of being traversed by light radiation from one face to the other, and a plate, made of an opaque coating material. , molded around the insert so that said opposite faces of the insert are at least partially uncovered.
    Said overmolded plate can be provided, in one piece, with an annular rib surrounding at a distance and projecting from one of said opposite faces of said insert.
    Electronic boxes and methods of manufacturing these boxes will now be described by way of nonlimiting examples, illustrated by the appended drawing in which:
    - Figure 1 shows a cross section of an electronic unit;
    - Figure 2 shows a cross section of a mold for manufacturing a cover of the housing of Figure 1, according to a manufacturing step;
    - Figure 3 shows a horizontal section of the mold of Figure 2;
    - Figure 4 shows a cross section of the manufacturing mold of Figure 2, according to another manufacturing step;
    - Figure 5 shows a step of manufacturing the housing of Figure 1, in cross section;
    - Figure 6 shows a cross section of another electronic unit;
    - Figure 7 shows a cross section of a mold for manufacturing a housing cover of Figure 6, according to VII-VII shown in Figure 8, in a manufacturing step;
    - Figure 8 shows a horizontal section of the mold of Figure 7;
    - Figure 9 shows a cross section of a manufacturing mold, according to IX-IX of Figure 7;
    - Figure 10 shows a cross section of the manufacturing mold of Figure 7, according to another manufacturing step;
    - Figure 11 shows a step in manufacturing the housing of Figure 6, in cross section;
    - Figure 12 shows a cross section of another electronic unit;
    - Figure 13 shows a cross section of the housing of Figure 12, along XIII-XIII; and
    - Figure 14 shows a section of a mold for manufacturing the cover of the housing of Figure 12.
    In FIG. 1 is illustrated an electronic unit 1 which comprises a support plate 2, made of an opaque dielectric material, including an integrated network of electrical connections 3 and having a rear face 4 and a front mounting face 5. The outline of the support plate 2 is for example square or rectangular.
    The housing 1 comprises an electronic chip 6 mounted above the front face 5 of the support plate 2, by means of a layer of adhesive 7 interposed between the front face 5 of the support plate 2 and a rear face 8 of the microchip 5.
    The chip 6 is provided, in a front face 8, with an integrated optical element 9, such as a transmitter and / or a light radiation sensor.
    The chip 6 is electrically connected to the connection network 2 by means of electrical wires 10 connecting studs on the front face of the support plate 2 and front studs of the electrical connection network 2 arranged on the front face of the chip 6, the rear face 4 of the support plate 2 being provided with electrical connection pads for external electrical connections.
    The housing 1 comprises an encapsulation cover 11 which is situated above and at a distance from the chip 6, parallel to the support plate 2 and which has an outline corresponding to that of the support plate 2.
    The cover 11 comprises an overmolded plate 12 of annular shape, in an opaque coating material, for example in a heat-cured resin, which has opposite rear and front faces 13 and 14, flat and parallel, and comprises an optical insert 15 which is in the form of a pellet and whose periphery is integrated and taken in a through passage 16 of the overmolded plate 12. The optical insert 15 is made of a material capable of being traversed by light on one side to the other of the plate 11 and is located opposite the integrated optical element 9 of the chip 5. The optical insert 15 is for example made of glass, possibly optically treated, and has for example a square or rectangular outline. For example, the optical insert 15 has rear and front faces 17 and 18 which extend substantially in the plane of the rear and front faces 13 and 14 of the overmolded plate 11.
    The cover 11 is fixed above the support plate 2 by means of an opaque local annular connecting spacer 19, interposed between a peripheral zone of the front face 5 of the support plate 2 and a peripheral zone from the rear face 13 of the overmolded plate 12 of the cover 11, the annular cord 19 extending at a distance from the periphery of the chip 6 and from the electrical connection wires 10 and at a distance from the periphery of the optical insert 15 of the cover 11.
    The thickness of the annular spacer 19 determines the spacing between the cover 10 and the support plate 2. The annular spacer 19 may comprise an opaque adhesive including spacing balls which determine a minimum spacing between the cover 10 and the support plate 2.
    Thus, the support plate 2, the cover 11 provided with the optical insert 15 and the connecting cord 19 define a sealed chamber 20 in which the chip 6 and the electrical connection wires 10 are located. If the integrated optical element 9 of the chip 6 is a light radiation emitter, this light radiation is emitted to the outside through the optical insert 15 of the cover 11. If the integrated optical element 9 of the chip 6 is a light radiation sensor , the external light radiation reaches the integrated optical element 9 by passing through the optical insert 15 of the cover 11.
    The cover 11 results from a collective manufacture which will now be described.
    As illustrated in FIGS. 2 and 3, there is a mold 20 which comprises a lower part 21 and an upper part 22 between which a cavity 23 is arranged. The parts 21 and 22 of the mold 20 have opposite faces 24 and 25 , flat and parallel, which delimit the cavity 23 in the thickness direction of the covers 11 to be obtained. Optionally, these opposite faces 24 and 25 are covered with layers 26 and 27 of a compressible material.
    There is also a plurality of optical inserts 15, for example from the cutting of a plate along parallel lines and parallel columns.
    The mold 20 being open, optical inserts 15 are placed on the compressible layer 26, respectively on locations of locations E corresponding to covers 11 to be obtained, these locations E being adjacent and arranged in a square or rectangular matrix.
    Then, the mold 20 is closed by placing the upper part 22 above the lower part 21. In this position, the opposite faces 17 and 18 of the optical inserts 15 are opposite the opposite faces of the cavity 23 and are pressed against the compressible layers 26 and 27. Free spaces separate the optical inserts 15, these spaces overlapping the lines and the separation columns of the adjacent locations E.
    Then, as illustrated in FIG. 4, an opaque coating material, for example a thermosetting epoxy resin, is injected into the cavity 23 of the mold 20 and this coating material is hardened.
    A collective plate 12A is obtained provided with optical inserts 15, and molded around these optical inserts 15 by providing through passages 16.
    According to an alternative embodiment, the collective plate 12A is cut along the rows and columns delimiting the locations E in order to obtain covers 11.
    According to another alternative embodiment, as illustrated in FIG. 5, there is an opaque collective support plate 2A which is provided, in locations E corresponding to electronic boxes 1 to be obtained, respectively with electronic connection networks 3 and which is provided, on its front face 5A, with electronic chips 6, respectively at locations of locations E, and of electrical connection wires 10, these locations E being adjacent and arranged in a square or rectangular matrix.
    Then, on the front face 5A of the collective support plate 2A, collective cords 19A of opaque adhesive are extended, along the border areas between the locations E, surrounding the central areas of the locations E on which the chips 6, these collective cords 19A being intended to form spacers 19 in each location E.
    Then, the overmolded collective plate 12A, provided with the optical inserts 15, is placed above the adhesive cords 19A and these adhesive cords 19A are hardened so as to fix the collective plate 12A above the collective support plate. 2A.
    Then, a cut out of the assembly is carried out, along the lines and columns of separation of the locations E, perpendicular to the plates 2A and 12A and through the beads of glue 19A, between and at a distance from the optical inserts 15.
    We then obtain a plurality of electronic boxes 1 produced in the locations E, in each of which the support plate 2 is a portion of the collective support plate 2A, the cover 11 comprises an overmolded plate 12 formed by a portion of the collective plate overmolded 12A, including an optical insert 15, and the spacer 19 is formed by a portion of the collective cords of hardened adhesive 19A, the cover 11 resulting from an overmolding of the plate 12 around the optical insert 15.
    According to an alternative embodiment, the beads of adhesive 19A could be replaced by a grid made of a glued rigid material, portions of this grid forming, after cutting, a spacer 19 in each location E.
    In FIG. 6, an electronic box 28 is illustrated which differs from the electronic box 1 as follows.
    The electronic unit 28 comprises a support plate 29 including an integrated network of electrical connections 30 and provided, on a front face 31, with two electronic chips 32 and 33 distant from each other, the chips 32 and 33 being connected to the network of electrical connections 30 by electrical wires 34 and 35 and being provided with integrated front optical elements 36 and 37.
    The electronic unit 28 comprises an encapsulation cover 38 which comprises an overmolded plate 39 extending in front and at a distance from the chips 45 and 46 and provided, in a single piece, with a projecting rear peripheral rib 40 and a rear internal rib 41, forming an internal partition.
    The overmolded plate 39 has rear surfaces 39a and 39b circumscribed by the peripheral rib 40 and separated by the internal rib 41 and has a flat front surface 39c. The rear surfaces 39a and 39b are parallel to the front surface 39c. The rear ends of the rear peripheral rib 40 and the internal rib 41 extend in the same plane parallel to the molded plate 39
    The flat rear end of the rear peripheral rib 40 extends above a peripheral zone of the front face 31 of the support plate 29, at a distance from the chips 32 and 33 and from electrical wires 34 and 35. The internal rib 41 passes between and at a distance from the chips 32 and 33. The flat rear end of the internal rib 41 extends above a central region of the front face 31 of the support plate 29 located between and at distance from chips 32 and 33.
    The encapsulation cover 38 is fixed above the support plate 29 by means of local strips of opaque adhesive 42 interposed between the rear ends of the rear peripheral rib 40 and the internal rib 41 and the front face 31 of the support plate 29.
    The cover 38 further comprises optical inserts 43 and 44, allowing the light to pass through, integrated in through passages 45 and 46 of the molded plate 39 and situated on either side of the intermediate rib 41 opposite the optical elements 36 and 37 of the chips 32 and 33. The optical inserts 43 and 44 extend respectively between on the one hand the surfaces 39a and 39b and on the other hand the surface 39c of the overmolded plate 39.
    The support plate 29 and the cover 38 define independent chambers 47 and 48 separated by the internal rib 41 and in which the chips 32 and 33 are located.
    ίο
    For example, the optical element 36 of the chip 32 can be an emitter of light radiation to the outside through the optical insert 43 of the cover 38 and the optical element 37 of the chip 33 can be a radiation sensor exterior light through the optical insert 44 of the cover 38. The electronic unit 28 can constitute a means of detecting the proximity of a body by processing the signals from the sensor 37.
    The cover 38 results from a collective manufacture which will now be described.
    As illustrated in FIGS. 7, 8 and 9, there is a mold 49 which comprises a lower part 50 and an upper part 51 between which a cavity 52 is arranged. The parts 50 and 51 of the mold 49 have opposite faces 53 and 54 which delimit the cavity 23 in the thickness direction of the covers 11 to be obtained.
    The face 53 of the lower part 50 of the mold 49 has adjacent locations E according to a matrix, corresponding to hoods 38 to be obtained. The face 53 has main grooves 55 in cross crossed in their midst by the rows and columns of the matrix forming the locations E and, in each location E, an intermediate groove 56 parallel to the rows of the matrix and joining the grooves 55 located on either side of location E.
    Thus, in each location E, the face 53 of the lower part 50 of the mold 49 comprises flat areas 57 and 58 circumscribed by corresponding portions of the grooves 55 and separated by a corresponding intermediate groove 56. The flat zones 57 and 58 extend in the same plane. The grooves 55 and 56, which are of U-shaped section, have the same depth relative to the flat areas 57 and 58. According to an alternative embodiment, the flat areas 57 and 58 could extend in different planes.
    The face 54 of the upper part 51 of the mold 49 is flat and parallel to the zones 57 and 58 of the lower part 50 of the mold 49.
    Optionally, the faces 57 and 58 of the lower part 50 of the mold 49 and the face 54 of the upper part 51 of the mold 49 are covered with layers 59, 60 and 61 in a compressible material.
    There are also a plurality of optical inserts 43 and 44.
    With the mold 49 open, optical inserts 43 and 44 are placed on the compressible layers 59 and 60 of the lower part 50, respectively on locations E corresponding to hoods 38 to be obtained.
    Then, the mold 49 is closed by placing the upper part 51 above the lower part 21, on the optical inserts 43 and 44. In this position, the opposite faces of the optical inserts 43 and 44 are pressed against on the one hand the compressible layers 59 and 60 and on the other hand against the compressible layer 61.
    Then, as illustrated in FIG. 10, an opaque coating material, for example a thermosetting epoxy resin, is injected into the cavity 52 of the mold 49 and this coating material is hardened.
    A collective plate 39A is obtained, ribbed on one side at the locations of the grooves 55 and 56 and provided with optical inserts 43 and 44, which are integrated and taken in the coating material constituting the collective plate 39A, the latter being overmolded. around the optical inserts 43 and 44 by fitting through passages 45 and 46.
    According to an alternative embodiment, the collective plate 39A is cut along the rows and columns delimiting the locations E in order to obtain covers 38.
    According to another alternative embodiment, as illustrated in FIG. 11, there is an opaque collective support plate 29A which is provided, in locations E corresponding to electronic boxes 1 to be obtained, respectively with electronic connection networks 30 and which is provided, on its front face 31 A, with electronic chips 32 and 33, respectively at locations of the adjacent locations E, and electrical wires 34 and 35.
    Then, on the front face 31A of the collective support plate 29A, collective strips 42A of opaque adhesive are extended in each location E in order to form the strips 42 of adhesive from the housings 28 to be obtained.
    Then, the overmolded collective plate 39A, provided with the optical inserts 15, is placed above the collective strips 42A of glue and this glue 19A is hardened so as to fix the collective plate 39A above the collective support plate 29A .
    Then, the assembly made up is cut out, along the lines and columns of separation of the locations E, perpendicular to the plates 29A and 39A and through the ribs 40A, in the direction of their length and dividing them by two to form the rear peripheral rib 40, and through corresponding hardened adhesive strips 42A.
    This gives a plurality of electronic boxes 28 produced in the locations E, the cover 38 resulting from an overmolding of the plate 39 around the optical inserts 43 and 44.
    In FIGS. 12 and 13, an electronic unit 62 is illustrated which differs from the electronic unit 28 only by the following arrangements.
    Equivalent to the electronic unit 28, the electronic unit 62 comprises an opaque support plate 63 which is provided, on its front face 64, with two electronic chips 65 and 66 distant from each other and glued to the front face 64.
    The chip 65 comprises, this time, two integrated front optical elements 67 and 68 in its front face 69 and the chip 66 comprises, as before, a front optical element 70 in its front face 71. The front optical elements 67, 68 and 70 are aligned.
    Equivalently to the electronic unit 28, the electronic unit 62 includes an encapsulation cover 72 which comprises an opaque overmolded front plate 73 provided with a projecting peripheral rear rib 74 and a rear internal projecting rib 75 forming a partition .
    This time, the rear internal rib 75 is located, not between the chips 65 and 66, but astride the chip 65, passing over the front face 69 and between and at a distance from the front optical elements. 67 and 68 of the chip 65. For this purpose, the rear internal rib 75 has a notch 76 crossed by the chip 65.
    The encapsulation cover 72 is fixed above the support plate 63 by means of local strips of opaque adhesive 77 interposed between on the one hand the front face 64 of the support plate 63 and on the other hand the flat rear ends of the rear peripheral rib 74 and parts of the rear internal rib 75 located on either side of the chip 65 and by means of a local strip of opaque adhesive 78 interposed between on the one hand the front face 64 and the sides 79 and 80 of the chip 65 and the flat faces of the notch 76 of the internal rear rib 75.
    The cover 72 further comprises optical inserts 81 and 82, allowing the light to pass through, integrated in through passages 83 and 84 of the plate 73 molded around the optical inserts 81 and 82. The optical inserts 81 and 82 are located on either side on the other side of the intermediate rib 75 and respectively opposite the optical element 67 of the chip 65 and opposite the optical element 70 of the chip 66.
    Thus, the support plate 63 and the cover 72 delimit chambers 85 and 86, separated by the internal rib 75, so that on the one hand the optical element 67 of the chip 65 is located in the chamber 81 and on the other hand, the optical element 68 of the chip 65 and the optical element 70 of the chip 66 are located in the chamber 82.
    According to one mode of operation, the optical elements 67 and 68 of the chip 65 are light radiation sensors and the optical element 70 of the chip 66 is a light radiation emitter. The emitter 70 of the chip 66 emits light radiation towards the outside through the optical insert 82. This light radiation present in the chamber 86 is picked up by the sensor 68 of the chip 65. The sensor 67 of the chip 65 captures the external light radiation through the optical insert 81. The electronic unit 62 can constitute a means of detecting the proximity of a body by processing the signals from the sensors 67 and 68.
    The cover 72 results from collective manufacture equivalent to that described above with reference to FIGS. 7 to 10.
    For this, as illustrated in FIG. 14, there is a mold 87 equivalent to the mold 49. The lower part 88 is provided with main grooves 55 in cross and intermediate grooves 56 which, this time, have respectively a central part 90 shallower than end parts 91 and 92 located on either side 10 of this central part, this central part making it possible to make the notch 76.
    The mounting of the cover 72 on the support plate is carried out in an equivalent manner to what has been described previously with reference to FIGS. 11.
    However, before the cover 72 is put in place, a strip of liquid or pasty glue is deposited on the chip 65, in order to produce the local strip of opaque glue 78.
    权利要求:
    Claims (20)
    [1" id="c-fr-0001]
    1. Method for manufacturing at least one cover for an electronic unit, comprising the following steps:
    placing at least one optical insert (15), having opposite faces (17, 18) and capable of being traversed by light radiation, between two opposite faces (24, 25) of a cavity (23) of a mold in a position such that said faces of the optical insert are in contact with said faces of said mold cavity, inject a coating material into said cavity, around said optical insert, and harden the coating material to obtain a plate (12) molded around said optical insert, so as to produce at least one cover (11) comprising at least one optical insert and at least a portion of said molded plate.
    [2" id="c-fr-0002]
    2. Method according to claim 1, comprising a subsequent step of cutting through said overmolded plate and at a distance from said optical insert.
    [3" id="c-fr-0003]
    3. Method according to one of claims 1 and 2, wherein the mold comprises opposite layers (26, 27) of a compressible material forming at least in part said faces of said cavity, said opposite faces (17, 18) of said optical insert (15) resting on these layers.
    [4" id="c-fr-0004]
    4. Method according to any one of the preceding claims, in which said opposite faces of the mold are parallel.
    [5" id="c-fr-0005]
    5. Method according to any one of claims 1 to 3, wherein one of said faces of the mold cavity comprises at least one zone (57) surrounded by at least one groove (55, 56), one of faces of the optical insert (43) being in contact above this zone, so that said plate (39) of the cover obtained is provided with at least one projecting rib corresponding to said groove in the mold.
    [6" id="c-fr-0006]
    6. Method according to claim 5, comprising a subsequent cutting step carried out through said projecting rib.
    [7" id="c-fr-0007]
    7. Method according to any one of claims 1 to 3, wherein one of said faces of the mold cavity comprises at least two zones (57) surrounded by at least one main projecting groove (55) and separated by at at least one intermediate groove (56), inserts having faces in contact above said zones, so that said plate (39) of the cover obtained is provided with at least one peripheral projecting rib (40) corresponding to said groove main mold and at least one intermediate rib (41) corresponding to said intermediate groove of the mold.
    [8" id="c-fr-0008]
    8. Method according to claim 7, comprising a subsequent cutting step carried out through said projecting peripheral rib (40).
    [9" id="c-fr-0009]
    9. Method according to one of claims 7 and 8, wherein said intermediate groove (56) has a shallower part (90), so that said plate (73) of the cover obtained is provided with an intermediate rib (75 ) having a notch (76) corresponding to said intermediate groove of the mold.
    [10" id="c-fr-0010]
    10. Electronic unit comprising:
    a support plate (2);
    at least one electronic chip (6) having a rear face fixed to a front face for mounting the support plate and provided with at least one optical element integrated in its front face; and an encapsulation cover (11) of said chip, comprising a plate (12) molded around an optical insert (15) allowing light radiation to pass from one side to the other of the molded plate, said cover ( 11) being fixed at least above said mounting face of said support plate in a position such that it extends above the chip.
    [11" id="c-fr-0011]
    11. Housing according to claim 10, wherein said cover (11) is fixed above said support plate by means of an annular bead of glue or an annular band of glue, interposed between a peripheral zone of the support plate and a peripheral zone of said overmolded plate.
    [12" id="c-fr-0012]
    12. Housing according to one of claims 10 and 11, wherein said molded plate is provided with an annular rib (40) surrounding said chip at a distance, the cover being fixed above said support plate by means of a strip of adhesive interposed between said support plate and said annular rib.
    [13" id="c-fr-0013]
    13. Housing according to claim 12, in which said molded plate is provided with an intermediate rib (41) delimiting two chambers (47, 48), this intermediate rib being fixed above said support plate by means of a glue strip.
    [14" id="c-fr-0014]
    14. Housing according to claim 13, wherein the support plate is provided with two electronic chips (32, 33) located respectively in said chambers.
    [15" id="c-fr-0015]
    15. Housing according to claim 14, wherein the support plate is provided with an electronic chip (65) which extends through a notch (76) of said intermediate rib (75), this intermediate rib being fixed. on this chip by means of a strip of adhesive (78).
    [16" id="c-fr-0016]
    16. Housing according to claim 15, wherein said electronic chip (65) is provided with two optical sensors (67, 68) located on either side of said intermediate rib (75).
    [17" id="c-fr-0017]
    17 Housing according to claim 16, wherein the support plate is provided with another electronic chip (66) provided with an optical transmitter (70).
    [18" id="c-fr-0018]
    18. Housing according to any one of claims 15 to 17, wherein said molded plate is provided with two optical inserts (43, 44) located on either side of said intermediate rib (41).
    [19" id="c-fr-0019]
    19. Cover for an electronic unit comprising an optical insert having opposite faces, made of a material capable of being traversed by light radiation from one face to the other, and
    1S a plate, made of an opaque coating material, molded around the insert so that said opposite faces of the insert are at least partially uncovered.
    [20" id="c-fr-0020]
    20. The cover of claim 19, wherein said plate
    5 overmolded is provided, in one piece, with an annular rib surrounding at a distance and projecting from one of said opposite faces of said insert.
    1/5
    类似技术:
    公开号 | 公开日 | 专利标题
    FR3061630A1|2018-07-06|METHOD FOR MANUFACTURING A HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD
    FR3073356A1|2019-05-10|ENCAPSULATION COVER FOR ELECTRONIC HOUSING AND METHOD OF MANUFACTURE
    EP2448001A2|2012-05-02|Optical device, method for manufacturing same and electronic packaging including said optical device
    FR2980643A1|2013-03-29|OPTICAL ELECTRONIC HOUSING
    FR3061629A1|2018-07-06|METHOD FOR MANUFACTURING A HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD
    FR3029687A1|2016-06-10|METHOD FOR MANUFACTURING ELECTRONIC DEVICES AND ELECTRONIC DEVICE WITH DOUBLE ENCAPSULATION RING
    FR3055509A1|2018-03-02|ELECTRONIC HOUSING COMPRISING A GROOVE HOOD
    FR3069406A1|2019-01-25|ELECTRONIC HOUSING AND METHOD OF MANUFACTURE
    TWI458113B|2014-10-21|Proximity sensor and its manufacturing method
    TW201735329A|2017-10-01|Optoelectronic module having dual encapsulation with opening for receiving an optical assembly
    FR2819634A1|2002-07-19|SEMICONDUCTOR PACKAGE WITH SENSOR PROVIDED WITH AN INSERT AND MANUFACTURING METHOD THEREOF
    FR2973573A1|2012-10-05|SEMICONDUCTOR HOUSING COMPRISING AN OPTICAL SEMICONDUCTOR DEVICE
    FR2988519A1|2013-09-27|OPTICAL ELECTRONIC HOUSING
    FR2835654A1|2003-08-08|Optical semiconductor case with coupled lens port, comprises integrated circuit chip with optical sensor inside the case and facing the lens
    FR2977715A1|2013-01-11|OPTICAL ELECTRONIC HOUSING
    FR3066643A1|2018-11-23|ELECTRONIC HOUSING PROVIDED WITH A LOCAL SLOT FORMING AN EVENT
    FR3061628A1|2018-07-06|METHOD FOR MANUFACTURING AN ENCAPSULATION HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD
    EP1226609B1|2006-12-20|Optical semiconductor housing and method for making same
    CN105206627A|2015-12-30|Optical sensor and manufacturing method thereof
    FR2977714A1|2013-01-11|OPTICAL ELECTRONIC HOUSING
    FR3078855A1|2019-09-13|ENCAPSULATION COVER FOR ELECTRONIC HOUSING AND METHOD OF MANUFACTURE
    FR3073120A1|2019-05-03|ENCAPSULATION HOOD FOR ELECTRONIC HOUSING
    FR3073980A1|2019-05-24|ENCAPSULATION COVER FOR ELECTRONIC HOUSING AND METHOD OF MANUFACTURE
    FR2943849A1|2010-10-01|METHOD FOR PRODUCING SEMICONDUCTOR HOUSINGS AND SEMICONDUCTOR HOUSING
    FR3078438A1|2019-08-30|PROCESS FOR MANUFACTURING A PLURALITY OF ELECTRONIC BOXES
    同族专利:
    公开号 | 公开日
    US10483408B2|2019-11-19|
    US20210043780A1|2021-02-11|
    US20180190838A1|2018-07-05|
    US10833208B2|2020-11-10|
    US20200020815A1|2020-01-16|
    FR3061630B1|2021-07-09|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    FR2835654A1|2002-02-06|2003-08-08|St Microelectronics Sa|Optical semiconductor case with coupled lens port, comprises integrated circuit chip with optical sensor inside the case and facing the lens|
    DE102005032664A1|2005-07-13|2007-01-25|Bayer Materialscience Ag|Composite component e.g. plastic window, producing method for e.g. household appliance, involves injecting synthetic material into hollow space between foils, and inserting molded part into cavity or injection molding tool|
    EP2448001A2|2010-10-28|2012-05-02|STMicroelectronics SAS|Optical device, method for manufacturing same and electronic packaging including said optical device|
    JPS5818223A|1981-07-28|1983-02-02|Omron Tateisi Electronics Co|Molding method|
    US5705851A|1995-06-28|1998-01-06|National Semiconductor Corporation|Thermal ball lead integrated package|
    US5695847A|1996-07-10|1997-12-09|Browne; James M.|Thermally conductive joining film|
    FR2758908B1|1997-01-24|1999-04-16|Thomson Csf|LOW COST MICROWAVE ENCAPSULATION BOX|
    US5766535A|1997-06-04|1998-06-16|Integrated Packaging Assembly Corporation|Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits|
    US6498099B1|1998-06-10|2002-12-24|Asat Ltd.|Leadless plastic chip carrier with etch back pad singulation|
    TW429494B|1999-11-08|2001-04-11|Siliconware Precision Industries Co Ltd|Quad flat non-leaded package|
    US6306685B1|2000-02-01|2001-10-23|Advanced Semiconductor Engineering, Inc.|Method of molding a bump chip carrier and structure made thereby|
    US6353257B1|2000-05-19|2002-03-05|Siliconware Precision Industries Co., Ltd.|Semiconductor package configuration based on lead frame having recessed and shouldered portions for flash prevention|
    DE10129388B4|2001-06-20|2008-01-10|Infineon Technologies Ag|Method for producing an electronic component|
    US6603193B2|2001-09-06|2003-08-05|Silicon Bandwidth Inc.|Semiconductor package|
    US7732914B1|2002-09-03|2010-06-08|Mclellan Neil|Cavity-type integrated circuit package|
    US6869824B2|2002-10-29|2005-03-22|Ultratera Corporation|Fabrication method of window-type ball grid array semiconductor package|
    US20040148772A1|2003-02-04|2004-08-05|Jackson Hsieh|Method for packaging an injection-molded image sensor|
    JP3859654B2|2003-07-31|2006-12-20|沖電気工業株式会社|Manufacturing method of semiconductor device|
    JP3838572B2|2003-09-03|2006-10-25|松下電器産業株式会社|Solid-state imaging device and manufacturing method thereof|
    TWI245429B|2003-12-23|2005-12-11|Siliconware Precision Industries Co Ltd|Photosensitive semiconductor device, method for fabricating the same and lead frame thereof|
    US7005720B2|2004-01-23|2006-02-28|Siliconware Precision Industries Co., Ltd.|Semiconductor package with photosensitive chip and fabrication method thereof|
    KR101213661B1|2005-03-31|2012-12-17|스태츠 칩팩, 엘티디.|Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides|
    JP4899481B2|2006-01-10|2012-03-21|サンケン電気株式会社|Manufacturing method of resin-encapsulated semiconductor device having a heat radiator exposed outside|
    US7749882B2|2006-08-23|2010-07-06|Micron Technology, Inc.|Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices|
    US20080057622A1|2006-09-01|2008-03-06|Powertech Technology Inc.|Map type semiconductor package|
    US20150227829A1|2008-08-29|2015-08-13|David Finn|Laminates for security documents|
    US8124451B2|2007-09-21|2012-02-28|Stats Chippac Ltd.|Integrated circuit packaging system with interposer|
    JP2009081346A|2007-09-27|2009-04-16|Panasonic Corp|Optical device and method for manufacturing same|
    US7906857B1|2008-03-13|2011-03-15|Xilinx, Inc.|Molded integrated circuit package and method of forming a molded integrated circuit package|
    US7759163B2|2008-04-18|2010-07-20|Infineon Technologies Ag|Semiconductor module|
    US8362607B2|2009-06-03|2013-01-29|Honeywell International Inc.|Integrated circuit package including a thermally and electrically conductive package lid|
    US7875970B2|2009-06-10|2011-01-25|Green Arrow Asia Limited|Integrated circuit package having a castellated heatspreader|
    JP5345017B2|2009-08-27|2013-11-20|三菱電機株式会社|Power semiconductor device and manufacturing method thereof|
    EP2758908A1|2011-09-20|2014-07-30|Life Technologies Corporation|Systems and methods for identifying sequence variation|
    FR2980643A1|2011-09-28|2013-03-29|St Microelectronics Grenoble 2|OPTICAL ELECTRONIC HOUSING|
    GB2505675A|2012-09-06|2014-03-12|St Microelectronics Pte Ltd|A cover for a sensor package with two transparent portions|
    KR20140038116A|2012-09-20|2014-03-28|제이앤제이 패밀리 주식회사|Led lamp|
    US9570413B2|2014-02-25|2017-02-14|Taiwan Semiconductor Manufacturing Company, Ltd.|Packages with solder ball revealed through laser|
    US9865522B2|2014-11-18|2018-01-09|International Business Machines Corporation|Composite heat sink structures|
    US9773740B2|2014-11-26|2017-09-26|Stmicroelectronics Sas|Stacked electronic device including a protective wafer bonded to a chip by an infused adhesive|
    FR3029687A1|2014-12-09|2016-06-10|Stmicroelectronics Sas|METHOD FOR MANUFACTURING ELECTRONIC DEVICES AND ELECTRONIC DEVICE WITH DOUBLE ENCAPSULATION RING|
    US10147834B2|2015-10-16|2018-12-04|Stmicroelectronics Pte Ltd|Overmold proximity sensor and associated methods|
    US20170127567A1|2015-10-28|2017-05-04|Stmicroelectronics Sas|Electronic device equipped with a heat sink|
    US9976894B2|2015-11-17|2018-05-22|Heptagon Micro Optics Pte. Ltd.|Optical device|
    KR20170069344A|2015-12-10|2017-06-21|삼성전자주식회사|Semiconductor package and method of fabricating the same|
    US9842776B2|2016-01-13|2017-12-12|Nxp B.V.|Integrated circuits and molding approaches therefor|
    FR3048305A1|2016-02-26|2017-09-01|Stmicroelectronics Sas|LOCALLY ENCAPSULATING BLOCK ELECTRONIC DEVICE WITH REDUCED THICKNESS|
    FR3053526B1|2016-07-01|2018-11-16|Commissariat A L'energie Atomique Et Aux Energies Alternatives|METHOD FOR COLLECTIVELY MANUFACTURING ELECTRONIC DEVICES AND ELECTRONIC DEVICE|
    FR3055509B1|2016-08-26|2018-09-21|Stmicroelectronics Sas|ELECTRONIC HOUSING COMPRISING A GROOVE HOOD|
    US20180117813A1|2016-11-02|2018-05-03|Asm Technology Singapore Pte Ltd|Molding apparatus including a compressible structure|
    FR3061629A1|2017-01-03|2018-07-06|Stmicroelectronics Sas|METHOD FOR MANUFACTURING A HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD|
    FR3061630B1|2017-01-03|2021-07-09|St Microelectronics Grenoble 2|METHOD OF MANUFACTURING A COVER FOR AN ELECTRONIC BOX AND ELECTRONIC BOX INCLUDING A COVER|
    FR3061628A1|2017-01-03|2018-07-06|Stmicroelectronics Sas|METHOD FOR MANUFACTURING AN ENCAPSULATION HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD|
    FR3061600B1|2017-01-03|2020-06-26|Stmicroelectronics Sas|ELECTRONIC DEVICE COMPRISING A GROOVED CHIP|
    FR3066643B1|2017-05-16|2020-03-13|Stmicroelectronics Sas|ELECTRONIC BOX PROVIDED WITH A LOCAL VENT-FORMING SLOT|
    FR3069406A1|2017-07-18|2019-01-25|Stmicroelectronics Sas|ELECTRONIC HOUSING AND METHOD OF MANUFACTURE|
    JP6943051B2|2017-07-19|2021-09-29|株式会社デンソー|Manufacturing method of semiconductor devices|US20180017741A1|2016-07-15|2018-01-18|Advanced Semiconductor Engineering, Inc.|Semiconductor package device and method of manufacturing the same|
    FR3061630B1|2017-01-03|2021-07-09|St Microelectronics Grenoble 2|METHOD OF MANUFACTURING A COVER FOR AN ELECTRONIC BOX AND ELECTRONIC BOX INCLUDING A COVER|
    FR3061628A1|2017-01-03|2018-07-06|StmicroelectronicsSas|METHOD FOR MANUFACTURING AN ENCAPSULATION HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD|
    US11137520B2|2019-02-22|2021-10-05|Microsoft Technology Licensing, Llc|Integrated depth sensor window lens and method|
    法律状态:
    2017-12-18| PLFP| Fee payment|Year of fee payment: 2 |
    2018-07-06| PLSC| Publication of the preliminary search report|Effective date: 20180706 |
    2019-12-19| PLFP| Fee payment|Year of fee payment: 4 |
    2020-12-17| PLFP| Fee payment|Year of fee payment: 5 |
    2021-12-15| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1750051|2017-01-03|
    FR1750051A|FR3061630B1|2017-01-03|2017-01-03|METHOD OF MANUFACTURING A COVER FOR AN ELECTRONIC BOX AND ELECTRONIC BOX INCLUDING A COVER|FR1750051A| FR3061630B1|2017-01-03|2017-01-03|METHOD OF MANUFACTURING A COVER FOR AN ELECTRONIC BOX AND ELECTRONIC BOX INCLUDING A COVER|
    US15/689,976| US10483408B2|2017-01-03|2017-08-29|Method for making a cover for an electronic package and electronic package comprising a cover|
    US16/581,978| US10833208B2|2017-01-03|2019-09-25|Method for manufacturing a cover for an electronic package and electronic package comprising a cover|
    US17/081,299| US20210043780A1|2017-01-03|2020-10-27|Method for manufacturing a cover for an electronic package and electronic package comprising a cover|
    [返回顶部]